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Classification and Selection of High-Frequency PCB Board Materials
Release time:
2026-01-21
A high-frequency PCB refers to a specialized printed circuit board designed for applications involving relatively high electromagnetic frequencies—typically frequencies greater than 300 MHz or wavelengths shorter than 1 meter...
A high-frequency PCB refers to a specialized printed circuit board designed for applications involving high electromagnetic frequencies—specifically, PCBs used in the high-frequency (frequency greater than 300 MHz or wavelength less than 1 meter) and microwave (frequency greater than 3 GHz or wavelength less than 0.1 meter) domains. These boards are manufactured either by employing certain processes from conventional rigid PCB fabrication methods on microwave-grade copper-clad laminates, or by utilizing special processing techniques. In general, high-frequency PCBs can be defined as those with operating frequencies above 1 GHz. The substrate material must exhibit excellent electrical performance and outstanding chemical stability, with minimal signal loss on the substrate as the frequency of the power signal increases. This is precisely why high-frequency PCB materials are of such critical importance.
What are the classifications of high-frequency PCB board materials?
I. Thermosetting Material Filled with Fine Ceramics
Processing method
The processing procedure is similar to that for epoxy resin/glass woven fabric (FR4); however, the board material is relatively brittle and prone to cracking. As a result, the lifespan of drill bits and milling cutters during drilling and routing operations is reduced by 20%.
II. PTFE (Polytetrafluoroethylene) Material
Processing method
1. Material Cutting: The protective film must be retained during cutting to prevent scratches and dents.
2. Drilling:
(1) Use a brand-new drill bit (standard 130); it’s best to stack one piece at a time, with a presser foot pressure of 40 psi.
(2) Use an aluminum sheet as the cover plate, then secure the PTFE sheet tightly using a 1 mm melamine spacer.
(3) After drilling, use an air gun to blow out the dust from inside the hole.
(4) Use the most stable drilling rig, and adjust the drilling parameters accordingly (generally speaking, the smaller the hole, the faster the drilling speed; the lower the chip load, the slower the feed rate).
3. Hole Treatment
Plasma treatment or sodium-naphthalene activation treatment facilitates hole metallization.
4. PTH copper plating
(1) After microetching (with the microetching rate controlled at 20 microinches), boards are fed into the PTH pull-through process starting from the degreasing tank.
(2) If necessary, proceed with the second PTH; simply start feeding the boards from the expected tank.
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