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Common Surface Treatment Methods for High-Frequency PCB Boards
Release time:
2026-01-21
When making high-frequency PCB prototypes, different surface finishing methods are employed depending on the number of layers. For simple single-layer and double-layer boards, the most common surface finishing methods are typically hot air solder leveling (HASL) or organic solderability preservative (OSP)...
When prototyping high-frequency PCBs, different surface finishing methods are employed depending on the number of layers. For simple single-layer and double-layer boards, the most common surface finishing methods are typically hot air solder leveling (HASL) or organic solderability preservative (OSP). For high-frequency boards with four or more layers, immersion gold plating is more frequently used. Each PCB surface finishing method has its own unique characteristics. Today, our editor will introduce several commonly used surface finishing methods for high-frequency PCB prototyping.
1. Tin spraying
Tin spraying, also known as Hot Air Solder Levelling (HASL), was initially the most commonly used surface finishing method for high-frequency PCB prototyping. With the advancement of PCB technology, the tin-spraying process has become highly mature and cost-effective. Today, there are two types of tin spraying: lead-free and leaded. Tin spraying is well-suited for visual inspection and electrical testing, and it ranks among the premium surface finishing options for high-frequency PCB prototyping.
2. Nickel-gold plating
Nickel-gold plating is also a widely used PCB surface treatment method in high-frequency PCB prototyping. The nickel layer in nickel-gold plating is a nickel-phosphorus alloy layer; we won't go into detailed explanations here. Nickel-gold plating is suitable for lead-free soldering, SMT, switch contact designs, aluminum wire bonding, thick boards, and more. It features an exceptionally smooth surface and exhibits strong resistance to environmental degradation.
3. Nickel-Palladium-Gold
Nickel-palladium-gold was previously more commonly used on semiconductors; however, with technological advancements, it is now gradually becoming suitable for high-frequency PCB prototyping as well. It is less expensive than ENIG and electroplated nickel-gold, compatible with a variety of surface finishing processes, and can be directly integrated onto the board.
4. Nickel plating
There is a distinction between hard gold and soft gold in nickel-gold plating. Hard gold, such as gold-cobalt alloys, is harder, while soft gold refers to pure gold. Nickel-gold plating is commonly used on IC substrates (e.g., PBGA), primarily for bonding gold wires and copper wires. However, when plating on C substrates, it’s necessary to add extra conductive traces at the locations where the gold fingers are bonded before proceeding with plating. In high-frequency PCB prototyping, nickel-gold plating is well-suited for contact switch designs and gold wire bonding, making it ideal for electrical testing.
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