Release time:

2026-01-21

Packaging refers to the encapsulating shell used to mount semiconductor integrated circuit chips. These shells serve multiple functions, including housing, securing, sealing, and protecting the chip, as well as enhancing heat dissipation performance—making them an indispensable component of semiconductor integrated circuit chips. Moreover, packaging also acts as a bridge that connects the internal world of the chip with external circuits. Therefore, chip packaging is divided into two distinct steps: “internal packaging” and “external packaging.” First, the factory connects the chip’s terminals to the substrate within the packaging shell using wires. This step is called “internal packaging.” Next, the substrate’s leads are connected to other components or circuit boards via its own leads; this stage is referred to as “external packaging.” As you can see, our chips aren’t directly soldered onto the circuit board. Instead, they’re first connected to a “substrate/chip base”—which serves as a bridge—through “internal packaging,” and then the “substrate/chip base” itself is connected to the circuit board via “external packaging,” thereby providing additional protection for the chip. Among these processes, the most common type of “internal packaging” is known as “flip-chip packaging.” In this method, the chip’s active side (the side containing the bonding pads) is flipped downward and directly attached to the substrate. Higher-end chips typically use this packaging method—for example, the components found in our computers. As for “external packaging,” depending on their appearance, the number of pins, pin pitch, size, and shape, they go by different names, with hundreds of varieties available. For instance, the SOP package—a type we often encounter—is shaped like a centipede and features multiple “L-shaped” pins; its variants alone number close to ten. Another example is the two commonly used packaging methods for CPUs: PGA pin-grid array (also known as pin grid array) and BGA ball-grid array (also known as ball grid array). The pin-grid array packaging features multiple square arrays of pins both inside and outside the chip. This allows the CPU to be easily and effortlessly inserted into a socket without any risk of poor contact. The plug-and-pull operation is more convenient, and the reliability is significantly higher. In contrast, the ball-grid array packaging has spherical bumps on its exterior. This packaging method not only boosts the yield rate of finished chips but also reduces signal transmission delays, greatly enhancing the chip’s ability to operate at higher frequencies. As such, it’s clear that “external packaging” doesn’t just affect the chip’s appearance—it also profoundly influences its performance and lifespan.