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TaiLian Electronics
What is COB?
Release time:
2026-01-21
COB stands for "Chip-On-Board," a new packaging technology that differs from the conventional SMD surface-mount packaging technique. Specifically, it involves adhering bare chips onto a PCB using conductive or non-conductive adhesive, followed by wire bonding to establish electrical connections. The chip and bonded wires are then encapsulated with an adhesive. This packaging approach does not eliminate the need for packaging altogether; rather, it integrates upstream and downstream enterprises, enabling the entire production process—from packaging to the fabrication of LED display modules or screens—to be completed within a single factory. By integrating and streamlining the production processes of both packaging and display-screen manufacturers, this approach makes the production process easier to organize and control. As a result, product pixel pitches can be made smaller, reliability is significantly enhanced, and costs become more affordable and accessible to the general public. COB light sources represent a high-efficiency integrated surface-lighting technology in which LED chips are directly mounted onto a highly reflective mirror-metal substrate. This technology eliminates the traditional framework concept, requiring no electroplating, reflow soldering, or surface-mount assembly processes. Consequently, the number of manufacturing steps is reduced by nearly one-third, and costs are also cut by about one-third. Simply put, COB light sources can be understood as high-power integrated surface light sources. Their light-emitting area and external dimensions can be tailored according to the specific design requirements of the product's shape and structure.
COB, which stands for "chip-on-board," is a new type of packaging technology that differs from the conventional SMD surface-mount packaging technique. Specifically, in COB packaging, bare chips are adhered onto a PCB using conductive or non-conductive adhesive. Then, wire bonding is performed to establish electrical connections, and finally, the chip and bonded wires are encapsulated with an adhesive. This packaging approach does not eliminate the need for packaging altogether; rather, it integrates upstream and downstream enterprises, enabling the entire production process—from packaging to the fabrication of LED display modules or screens—to be completed within a single factory. By integrating and streamlining the production processes of both packaging and display-screen manufacturers, this approach makes the production process easier to organize and control. As a result, product pitch can be reduced further, reliability is significantly enhanced, and costs become more accessible to the general public.
COB light sources are high-efficiency integrated surface-lighting technologies that directly mount LED chips onto highly reflective mirror-metal substrates. This technology eliminates the concept of a frame, requires no electroplating, no reflow soldering, and no chip-mounting process. As a result, the number of manufacturing steps is reduced by nearly one-third, and costs are also cut by one-third.
A COB light source can be simply understood as a high-power, integrated surface light source. The light-emitting area and external dimensions of the light source can be designed according to the product’s shape and structural features.
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Shantou Tai Lian Electronics Co., Ltd.
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